Major Equipment

juki

(4) Juki KE-2080

Features:

  • 20,200CPH: chip (laser centering/effective tact)
  • 1,850CPH IC (vision centering/effective tact) 4,860CPH with MNVC
  • One multi-nozzle laser head (6 nozzles) plus one high resolution head (1 nozzle)
  • From 0402 (01005) to 74mm square components or 50×150mm
  • Vision centering system (featuring bottom, side, and back lighting, all ball recognition and split recognition)
  • Ultra fine pitch placement Micro BGA
  • 15 interchangeable trolley carts, for optimized productivity

quad

(2) QUAD IVC PLACEMENT MACHINES

Features:

  • Rating of 3,600 parts placed per hour
  • 120 feeders
  • Precision vision optical system
  • Ultra fine pitch placement capabilities
  • Automatic digital glue dispenser (for dual sided SMT)
  • QuadAlign system provides automatic correcting for X,Y and theta positioning
  • Max/Min board size 3.0" - 23.9"
  • BGA capabilities

Horizon-X-series-head-on

DEK Horizon 03iX

Features:

  • Hawk Eye Camera Alignment for print repeatability
  • Advanced capability for fine-pitch and leading-edge assemblies
  • A 12-second cycle time and intuitive Instinctiv V9 operator control
  • Six Sigma machine alignment capability of 2 Cpk @ +/- 12.5µm
  • Six Sigma process alignment capability of 2 Cpk @ +/- 25µm
  • Fiducial Vision centering system
  • Prints Ultra fine pitch Micro BGA, 01002

mpm

(2) MPM ULTRPRINT 500 STENCIL PRINTER

Features:

  • Automatic board stencil alignment
  • Triple stage conveyor system
  • Statical process control
  • Programmable print head control
  • Closer loop pressure control system
  • Under stencil cleaning system
  • Automatic paste dispensing system
  • Automatic support pin placement system
  • Integrated pos-print analysis and adaptive 2D intelligence
  • 2D inspection and auto tooling

quadsc

(5) QUAD VMP-100MV AUTOMATIC SCREEN

Features:

  • 20" x 20" screen/stencil
  • Dual camera with vision processor
  • Menu-driven control software for fast set-up and ease of use
  • SMEMA compliant tooling system
  • Compact footprint with 0.4 mm ultra-fine pitch capability
  • Advanced Vision Alignment: adjustable from 3x4 mm to 8x6 mm
  • Print Area:400x450 mm (15.7x17.7 in) Dual Stage Passe

 

XPM3i_2_col

VITRONICS SOLTEC XPM3

Features:

  • Autoset_logo_mini_inline.jpg profile/recipe generator
  • 350°C maximum setpoint temperature
  • Lifetime warranty on heaters and blowers
  • Flux Flow Control™ flux evacuation system
  • Patented individual Cell Inlet and Exhaust™ enables optimized gas flow management
  • Active forced convection top and bottom cooling cells
  • Easy to maintain cooling zones
  • Advanced controlled cooling
  • Nitrogen atmosphere with true air switching and quick purge
  • CAMX host communication software
  • Condensing gas recirculation system
  • Bar code traceability system

qoven

QUAD ZCR CONVECTION REFLOW OVEN

Features:

  • Computer system with easy-to-use graphic display operating software
  • A passive pre-heat section and an integrated thermal profiling system
  • Computer controlled rail width adjustment for edge rail
  • Multi level password protection
  • Closed loop conveyor speed control
  • Four channel PCB thermal profiling
  • 4 - 4 temperature controlled zones

vitronics

VITRONICS 722 IR REFLOW OVEN

Features:

  • Temperature controller Anafaze 10-10 zone PID controller
  • Preheat chamber: 1- 3zone
  • Flow chamber: 7 zones SSR switching for zero crossing control
  • Belt speed control: HPC, Varispeed 2000
  • Non-reactive gas atmosphere, for limiting oxidization during cooling

vcd6285

UNIVERSAL INSTRUMENTS VCD MODEL 6285

Features:

  • Sequencing and insertion of axial components and jumper wires
  • VCD/Sequencer 8 delivers reliable productivity.
  • 200 ppm
  • Component changeover is minimized with over 220 available inputs

wave

ELECTROVERT ECONOPACK I SMT WAVESOLDERING SYSTEM

Features:

  • Preheater Module - Additional Preheater
  • Solder Module - Dual Wave (Lambda/Chip)
  • Conveyor Module - Finger Cleaner
  • Recipe-driven solder pot height adjustment (auto lead clearance)
  • Designed for medium to high volume production that requires fast changeover

SCSPrecision1

SCS PRECISION COAT MACHINE

Features:

  • Solvent-based and water-based coatings
  • Three-axes system with an accuracy of 0.001 inches
  • Fully programmable fourth and fifth axes can be added for tilt and rotate functionality
  • Precisioncoat is controlled by proprietary software on a Windows® operating system
  • Vision centering system
  • Applying materials such as photoresists, acrylics, adhesives and solder masks, to virtually any surface or substrate, with maximum accuracy

aligent

(4) AGILENT E5052A SIGNAL SOURCE ANALYZER

Features:

  • 10 MHz to 110 GHz frequency range
  • Versatile measurement functions in a single instrument
  • Phase noise measurement
  • Transient measurement (frequency/phase/power over time)
  • Frequency, power, and DC current measurement (VCO characterization)
  • Spectrum monitoring

rtx113

RTX-113/w RTVA IMAGE PROCESSOR

Features:

  • The RTX-113 provides affordable real-time X-ray imaging
  • Multi-layer PCBs
  • Small Hole Drilling
  • BGA Inspection
  • Backplane Boards

bga3500

METCAL BGA-3590 SERIES REWORK STATION

Features:

  • BGA/CSP-3590 Series Base Unit
  • The BGA-3590 systems provide a maximum four-sided view of 46 mm x 46 mm
  • The zoom lens magnification has a range of 10X to 50X
  • Closed-loop K-type thermocouple feedback
  • Rework System provides both accurate component placement
  • Specifically tailored reflow profiles

dipper

APS NOVASTAR LEAD FREE HIGH TEMPERATURE DIP SOLDER

Features:

  • Articulated dipping movement prevents trapping of air bubbles
  • Three (3) stage timed process includes flux cycle, preheat cycle and solder cycle
  • Microprocessor control with LCD display
  • Twelve (12) menu storage
  • Flux station with flux drain
  • Stainless steel solder pot
  • Pallet with adjustable titanium fingers hold PCBs
  • High temperature (350°C), lead-free model

HP_8561E

AGILENT 8561E SPECTRUM ANALYZER

Features:

  • Rating of 3,600 parts placed per hour
  • 120 feeders
  • Precision vision optical system
  • Ultra fine pitch placement capabilities
  • Automatic digital glue dispenser (for dual sided SMT)
  • QuadAlign system provides automatic correcting for X,Y and theta positioning
  • Max/Min board size 3.0" - 23.9"
  • BGA capabilities

2-084B_L

Automatic Wire Stripping Machine

Features:

  • Power Req : AC 250 V / 50 Hz / 0.5 KW
  • Dimension : 380 x 250 x 420 mm
  • Weight : 28.0 kg. Performance Range :
  • Length Setting : 50 mm to 10 meters in steps of 0.01 mm
  • Accuracy : + 1.0% (Depending on Wire length)
  • End Stripping : 2.0 mm to 35 mm
  • Wire size : 0.25 sq mm to 4.0 sq mm
  • Wire Type : PVC, Teflon and Glass Wire (Single core or Multiple strands

 

 

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